A P P E N D I X D

Bibliography

D.1 General References

The following books and specifications are referenced that relate the Netra CP2160 board design.

D.1.1 Books and Specifications

PCI Special Interest Group.PCI Local Bus Specification, Revision 2.1. Available at http://www.pcisig.com. Portland, OR. June 1995.

PCI Special Interest Group.PCI Hot-Plug Specification, Revision 1.0. Available at http://www.pcisig.com.Portland, OR. <Date?>

PCI Industrial Computers Manufacturers Group. CompactPCI Specification, PICMG 2.0 R3.0, October 1999.

PCI Industrial Computers Manufacturers Group. CompactPCI Specification Short Form, PICMG 2.0 R2.1, September 1997.

PCI Industrial Computers Manufacturers Group. CompactPCI Hot Swap Specification, PICMG 2.1 R1.0, Wakefield, MA, August 1998.

CompactPCI Multi Computing Specification, PICMG 2.14; This reference covers several documents presently in draft form

PCI Industrial Computers Manufacturers Group. CompactPCI Computer Telephony Specification, PICMG 2.5 R1.0, April 1999.

PCI Industrial Computers Manufacturers Group. CompactPCI Power Interface Specification, PICMG 2.11 R1.0, October 1999.

PCI Industrial Computers Manufacturers Group. PMC on CompactPCI Specification, PICMG 2.3 R1.0. August 1998.

PCI Industrial Computers Manufacturers Group. CompactPCI 6U Dual System Slot Specification, PICMG 2.7

PCI Industrial Computers Manufacturers Group. IP on CompactPCI Specification, PICMG 2.4 R1.0. August 1998.

PCI Industrial Computers Manufacturers Group. PCI-PCI Bridge Board Connector for Single Board Computer, PICMG 1.1 R1.0

PCI Industrial Computers Manufacturers Group. VME64X on CompactPCI Specification, PICMG2.2 R1.0. August 1998.

PCI Industrial Computers Manufacturers Group. Keying of CompactPCI Boards and Backplanes, PICMG 2.10 Draft 0.4, September, 1998.

Enterprise Computer Telephony Forum, H110 Hardware Compatibility Specification: CT Bus, Revision 1.0. 1997.

Intel Corporation, Hewlett Packard Company, NEC Corporation, Dell Computer Corporation. Intelligent Platform Management Interface Specification, v1.0, Document Revision 1.1. August 1999.

Bureau Central de la Commission Electrotechnique Internationale. EuroBoard Specification, IEC 297-3 and -4. Geneva, Switzerland.

International Electrotechnical Commission, American National Standards Institute, Draft Specification for 2 mm Connector Systems, IEC-61076-4-101. New York, NY.

IEEE, Draft Standard for a Common Mezzanine Card Family: CMC, P1386 Draft 2.1, New York, NY. Oct. 1999. Covers mechanical specifications for PMC cards.

VITA Standards Organization. PMC I/O Module Standard, VITA 36, 199X, Draft 0.1, Scottsdale, AZ. July 1999. Gives mechanical definition and contact assignments for PIM cards.

Institute of Electrical and Electronics Engineers, Inc. Draft Standard Physical and Environmental Layers for PCI Mezzanine Cards PMC, P1386.1 Draft 2.1. New York, NY. October 1999. Covers electrical specifications and contact assignments for PMC cards.

Institute of Electrical and Electronics Engineers, Inc. IEEE Standard for Mechanical Rear Plug-in Units Specifications for Microcomputers Using IEEE 1101.1 and IEEE 1101.10 Equipment Practice, IEEE Std 1101.11-1998. New York, NY. 1998. ISBN 0-7381-0179-6

Institute of Electrical and Electronics Engineers, Inc. IEEE Standard for Mechanical Core Specifications for Microcomputers Using IEC 603-2 Connectors, IEEE 1101.1-1991, New York, NY.

Institute of Electrical and Electronics Engineers, Inc. IEEE Standard for Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice, IEEE Std. 1101.10-1996. New York, NY. 1997. ISBN 1 55937-863-8

Institute of Electrical and Electronics Engineers, Inc.IEEE Standard for Additional Mechanical Specifications for Microcomputers using IEEE 1101.1 Equipment Practice, IEEE 1101.11. Piscatowany, NJ.

Institute of Electrical and Electronics Engineers, Inc.IEEE Standard: Test Access Port and Boundary-Scan Architecture, IEEE Std 1149.1-1990. New York, NY. 1990.

Institute of Electrical and Electronics Engineers, Inc. IEEE Standard: Telecommunications and Information Exchange Between Systems--Local and Metropolitan Area Networks--Specific Requirements--Part 3: Carrier Sense Multiple Access With Collision Detection (CSMA/CD) Access Method And Physical Layer Specifications, IEEE Std 802.3-1998. New York, NY. 1998. (This edition includes all contents of the 8802-3:1996 Edition, plus IEEE Std 802.3aa-1998, IEEE Std 802.3r-1996, IEEE Std 802.3u-1995, IEEE Std 802.3x&y-1997, and IEEE802.3z-1998).

Intel Corporation. 21554 PCI-to-PCI Bridge for Embedded Applications Product Preview Datasheet, Order Number: 278089-001. December 1998.

21554 PCI-to-PCI Bridge for Embedded Applications Hardware Reference Manual Order Number: 278091-001, September 1998, Intel Corporation,

21154 PCI-to-PCI Bridge Configuration Application Note Order Number: 278080-001, October 1998, Intel Corporation

21554 Embedded PCI-to-PCI Bridge Hardware Implementation Application Note Order Number: 278218-002, March 1999, Intel Corporation

Linear Technology LTC1643L/LTC1643H PCI-Bus Hot Swap Controller, September 1998

Dallas Semiconductor. DS80CH11 System Energy Manager Product Specification, V2.0 15.

Dallas Semiconductor. High-Speed Microcontroller User's Guide.

Philips Semiconductors. I2C Peripherals Data Handbook IC12. 1997.

Shanley, Tom, and Don Anderson andMindshare, Inc. PCI System Architecture , 4th ed., Reading MA: Addison Wesley, 1999

Solari, Edward, and George Willse. PCI Hardware and Software Architecture and Design. San Diego: Annabooks, 1998.

D.2 Sun Microsystems Publications

These books and papers are available in printed form, and some are also available through the World Wide Web.

The docs.sun.com^SM Web site enables you to access Sun technical documentation online. You can browse the docs.sun.com archive or search for a specific book title or subject. The URL is http://www.sun.com/documentation

D.2.1 Solaris Operating Environment

Solaris 8 (SPARC Platform Edition) Installation Guide, Part No. 806-0955-xx

Solaris 8 Advanced Installation Guide, Part No. 806-0957-xx

Solaris 8 System Administration Supplement, Part No. 806-6611-xx

System Administration Guide, Volume 1, Part No. 805-7228-xx (contains chapters on device management and configuring devices--presently deals with hot- plug considerations).

System Administration Guide, Volume 2, Part No. 805-7228-xx (of general interest)

System Administration Guide, Volume 3, Part No. 805-7228-xx (of general interest)

man pages section 1M: System Administration Commands, Part No. 806-0625-xx (covers cfgadm command; see above discussion on hot-swap support in the reference to the System Administration Guide, Volume 1.)

OpenBoot 4.x Command Reference Manual, Part No. 816-1177-xx

Writing FCode 3.x Programs, Part No. 806-1379-xx February 2000, Rev

OpenBoot 3.x Quick Reference, Part Number 806-2908-10, February 2000, Revision A

Solaris Naming Administration Guide, Part No. 806-1387-xx

Solaris Naming Setup and Configuration Guide, Part No. 806-1386-xx

Writing Device Drivers, Part No. 805-7378-xx (includes information about the device tree)

D.2.2 Alternate Pathing

These documents can be read for an approximation of the installation procedure that will apply to the CP2000 HA platform.

Sun Enterprise Server Alternate Pathing 2.3 User Guide, Part No. 806-1933-xx

Sun Enterprise Server Alternate Pathing 2.3 Reference Guide, Part No. 806-1934-xx

D.2.3 Processors and Integrated Circuits

Advanced PCI Bridge Users Manual, Part No. 805-1251-xx

D.2.4 CP2000/CP2160 Family System Documents

Refer to the following web site to access the Netra CP2160 documentation, as well as the other Netra CP2000/CP2100 board documentation.

http://www.sun.com/products-n-solutions/hardware/docs/CPU_Boards